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  • 1.
    Cheng, Shi
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microwave and Terahertz Technology.
    Yousef, Hanna
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Kratz, Henrik
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    79 GHz Slot Antennas Based on Substrate Integrated Waveguides (SIW) in a Flexible Printed Circuit Board2009In: IEEE Transactions on Antennas and Propagation, ISSN 0018-926X, E-ISSN 1558-2221, Vol. 57, no 1, p. 64-71Article in journal (Refereed)
    Abstract [en]

    The design, fabrication and characterization of 79 GHz slot antennas based on substrate integrated waveguides (SIW) are presented in this paper. All the prototypes are fabricated in a polyimide flex foil using printed circuit board (PCB) fabrication processes. A novel concept is used to minimize the leakage losses of the SlWs at millimeter wave frequencies. Different losses in the SlWs are analyzed. SIW-based single slot antenna, longitudinal and four-by-four slot array antennas are numerically and experimentally studied. Measurements of the   antennas show approximately 4.7%, 5.4% and 10.7% impedance bandwidth (S-11 = -10 dB) with 2.8 dBi, 6.0 dBi and 11.0 dBi maximum antenna gain around 79 GHz, respectively. The measured results are in good agreement with the numerical simulations.

  • 2.
    Hjort, Klas
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Yousef, Hanna
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Lindeberg, Mikael
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Ion track lithography for flexible PCB manufacturing2008In: International Confonference on Atomic Collisions in Solids – ICACS23, 2008, p. 61-66Conference paper (Refereed)
  • 3.
    Jensen, Jens
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Ion Physics.
    Kubart, Tomas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
    Martin, David
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
    Surpi, A
    Blom, Tobias
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Experimental Physics.
    Topalian, Z
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Physics.
    Yousef, H
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Sanz, R
    Damage formation in TiO2 by heavy ions: consequences for micro- and nano-struring2008In: 7th International Symposium on Swift Heavy Ions in Matter (SHIM2008), Lyon, France, 2008Conference paper (Refereed)
  • 4.
    Lindeberg, Mikael
    et al.
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Skupinski, Marek
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Yousef, Hanna
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Hjort, Klas
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Ion track enabling of microsystems in printed circuit boards2004In: 5th Micro Structure Workshop, Ystad, Sweden, 2004, p. 45-46.Conference paper (Other scientific)
  • 5.
    Lindeberg, Mikael
    et al.
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science. Technology, Department of Engineering Sciences, Ion Physics. Jonfysik.
    Yousef, Hanna
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science. Technology, Department of Engineering Sciences, Ion Physics.
    Hjort, Klas
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science. Technology, Department of Engineering Sciences, Ion Physics.
    How to deal with stochastically distributed ion tracks in sensor applications2005In: , 6th Int. Symp. On Swift Heavy Ions in Matter, SHIM (May 28-31, 2005, Aschaffenburg, Germany) O-4., 2005Conference paper (Refereed)
  • 6.
    Lindeberg, Mikael
    et al.
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Yousef, Hanna
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Hjort, Klas
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Ion track enabled Kapton-HN™ PCB-Process technology for sensor applications, Abstract collection2004In: The 2nd Int. Workshop on Ion Track Technology, Uppsala, Sweden, 2004Conference paper (Refereed)
  • 7.
    Lindeberg, Mikael
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Yousef, Hanna
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Rödjegård, Henrik
    Martin, Hans
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    A PCB-like Process for Vertically Configured Thermopiles2008In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 18, no 6, p. 065021-Article in journal (Refereed)
    Abstract [en]

    Thermopiles are important components in infrared thermal detectors, thermoelectric generators and thermoelectric coolers. We present a thermopile structure with up to 224 vertically arranged thermocouple legs in a polyimide flex material. The thermopile is optimized for infrared thermal radiation detection and is fabricated using printed circuit board-like (PCB-like) processing. Each thermoelectric leg consists of a bundle of a few hundred sub-micrometre-sized strands of either antimony or nickel. These metal wire bundles were achieved by employing ion track technology on the polyimide foil, resulting in a porous dielectric material. Electrochemical methods were used to grow the thermoelectric materials in the pores. The plating mask was produced in a laminated dry photoresist. A small metal cross section, 20 mu m(2) (1 vol%), ensured a low heat exchange between the two surfaces of the flex. The typical resistance per thermocouple was 34 Omega. A responsivity to irradiance of 4.3 V mm(2) W(-1) was measured when heating with a white light source (irradiance 1 mW mm(-2)).

  • 8.
    Lindeberg, Mikael
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Yousef, Hanna
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Röjdegård, Henrik
    Martin, Hans
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology. Materialvetenskap.
    Flexible PCB Vertical Thermopile IR Sensor Proc. Solid-State Sensors, Actuators and Microsystems Conference2007Conference paper (Refereed)
  • 9.
    Lindeberg, Mikael
    et al.
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Yousef, Hanna
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Öjefors, Erik
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Rydberg, Anders
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Hjort, Klas
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Ion track enabled flexible PCB via technology2004In: MRS Fall Meeting 2004, Symposium G: Materials, Integration, and Packaging Issues for High-Frequency Devices II, Boston, USA, 2004Conference paper (Refereed)
  • 10.
    Yousef, H
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Cheng, Shi
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Signals and Systems Group.
    Kratz, Henrik
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Rydberg, Anders
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Signals and Systems Group.
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Substrate integrated waveguides in flexible PCB2008In: IMAPS Advanced Technology Workshop on RF and Microwave Packaging, 2008Conference paper (Refereed)
  • 11.
    Yousef, Hanna
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Cheng, Shi
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microwave and Terahertz Technology.
    Kratz, Henrik
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Substrate Integrated Waveguides (SIW) in a Flexible Printed Circuit Board for Millimeter Wave Applications2009In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 18, no 1, p. 154-162Article in journal (Refereed)
    Abstract [en]

    Substrate integrated waveguides (SIWs) are presented and demonstrated in a flexible printed circuit board (flex PCB) for application in the 77-81 GHz range. The vertical walls of the SIWs presented in this paper consist of multiple electrodeposited metallic wires. The diameters of these wires and the spacing between them are on the order of hundreds of nanometers. Hence, the walls can be seen as continuous metallic walls, and the leakage losses through them become negligible. In turn, the SIWs presented in this paper can operate at higher frequencies compared with previously presented structures that are realized with PCB fabrication processes. The attenuation of the SIWs is comparable to that of microstrip lines on the same sample. The SIWs are successfully demonstrated in a SIW-based slot antenna. The antenna gain along the z-axis (normal-to-plane) was found to be around 2.8 dBi at 78 GHz which is in agreement with the simulated values. [2008-0047]

  • 12.
    Yousef, Hanna
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Lindeberg, Mikael
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Plated Through-Hole Vias in a Porous Polyimide Foil for Flexible Printed Circuit Boards2008In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 18, no 1, p. 017001-Article in journal (Refereed)
    Abstract [en]

    A fabrication process for high aspect ratio plated through-hole vias is presented for flexibleprinted circuit boards. A 75 μm thick porous Kapton foil that allows direct definition of highaspect ratio through-hole vias by dry photoresist film lithography and electrodeposition ispresented. Pretreatment with swift heavy ion irradiation and wet etching define the poredensity and porosity of the foil, similar to ion-track-etched filter membranes. Thin filmmetallization of a seed layer and lithography of a laminated dry photoresist film define the viasizes and positions. Subsequent through-hole electrodeposition produces vias consisting ofmultiple wires, where each open pore defines one wire. The via geometries are characterizedby scanning electron microscopy. The electrical properties of the vias are characterized byresistance measurements. Vias with an aspect ratio over 2 and a side length of 33 μm showhigh yield with low resistance and low variation in resistance.

  • 13.
    Yousef, Hanna
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences.
    Lindeberg, Mikael
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
    Reliable small via interconnects made of multiple sub-micron wires in flexible PCB boards2007In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 17, no 4, p. 700-708Article in journal (Refereed)
    Abstract [en]

    A fabrication process for small through-hole vias consisting of multiple sub-micron electrodeposited wires has been developed for flexible printed circuit boards (PCB). The resistance of the vias is controlled by adjusting the number of wires per via, as well as the dimensions of the wires. The process steps include modification of the foils by irradiation with energetic ions, wet etching and metallization of the through-hole vias, double-sided surface metallization of the dielectric layer and interconnection lithography. Series of up to 360 interconnected vias of electrodeposited nickel are demonstrated in a flexible PCB foil (75 µm Kapton HN polyimide). The vias have a lateral size of 26 µm. The metal content of the demonstrated vias is 0.12% and 10% of their total volume, corresponding to a metal cross-section of 3.2 µm2 and 270 µm2, respectively. The electrical resistance per interconnected via is 2.6 Ω and 0.07 Ω, respectively. The vias can carry a current density of at least 4 × 106 A cm−2.

  • 14.
    Yousef, Hanna
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Mikael, Lindeberg
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Vertical Thermopiles Embedded in a Polyimide-Based Flexible Circuit Board2007In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 16, no 6, p. 1341-1348Article in journal (Refereed)
    Abstract [en]

    A fabrication process for vertical thermopiles embedded in a 75-mu m-thick polyimide foil has been developed for flexible printed circuit boards (flex PCBs). The vertical connections consist of electrodeposited antimony- and nickel-plated through-hole vias. The plated through-hole vias consist of multiple wires, with a total metal content that is 1% of the total via volume. The via fabrication technique is similar to standard flex PCB wet etch and metallization processes. The main difference is that the foils are pretreated with ion irradiation to induce highly selective vertical etch rates. The thermopiles were characterized by measuring their voltage response to an applied temperature difference across the foil thickness.

  • 15.
    Yousef, Hanna
    et al.
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Lehto, Marcus
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Jäderblom, Tomas
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Enculescu, I
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Hjort, Klas
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    A Device Integrating Paraffin Microactuator, Fluidic Compartment and Microneedle array for Fluid Injection or Sampling2005In: 9th International Conference on Miniaturized Systems for Chemistry and Life Sciences, 2005Conference paper (Refereed)
  • 16.
    Yousef, Hanna
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Lindeberg, Mikael
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
    Ion Track Enabled Multiple Wire Microvia Interconnects in Printed Circuit Boards2008In: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, ISSN 0168-583X, E-ISSN 1872-9584, Vol. 266, no 8, p. 1659-1665Article in journal (Refereed)
    Abstract [en]

    As the call for higher wiring density in packaging and vertical microvia interconnections (microvias) rapidly evolves, the need for smaller lateral dimensions in printed circuit boards (PCB) microvias must be met. The ion track lithography described in this paper allows for high throughput micromachining of small, deep, vertical microvias in flexible PCB and all-polymer laminates.

    Ion track lithography makes use of swift heavy ion irradiation to enhance the selectivity and directionality of chemical etching. Within the areas exposed to the ion irradiation, small sub-micron pores (capillaries) are created, one for every ion. If etching is prolonged, the pores become merged. Electrodeposition from a metallic seed layer is used to fill these structures with metal. The lithography masks define either the areas where the ion tracks are developed or where the tracks are metallized. The smallest achievable size of the microvias is only limited by the resolution of the mask; microvias below 10 μm in diameter can also be achieved also in thick polyimide foils.

    Since each impinging ion forms one track, the foil’s porosity can be controlled by adjusting the irradiation dose, as well as by etching the pores to a suitable size. Depending on the porosity and material, the resultant metallized microvia consists of either individual or interlaced wires (like strands in a bundle wire), or is a solid. As an individual sub-micron wire may have an aspect ratio of several hundreds, this allows for the fabrication of truly vertical microvia structures, allowing ultra-high density microvia batch production.

    Demonstrator microstructures with highly vertical microvias have been fabricated in foils up to 125 μm thickness. Several components integrated in flexible PCB have been presented by us, e.g. magnetoresistive sensors, thermopile IR-sensors and microwave components like inductor elements.

  • 17.
    Yousef, Hanna
    et al.
    Uppsala University.
    Lindeberg, Mikael
    Uppsala University.
    Hjort, Klas
    Uppsala University.
    Ion track enabled multiple wire via interconnects in printed circuit boards2007In: 18th Int Conf on Ion Beam Analysis: IBA18, (Hyderabd, India, 23-28 September, 2007), 2007Conference paper (Other (popular science, discussion, etc.))
  • 18.
    Yousef, Hanna
    et al.
    Uppsala University.
    Lindeberg, Mikael
    Uppsala University.
    Hjort, Klas
    Uppsala University.
    Ion track technology for electronics manufacturing2008In: 7th Int. Symp. on Swift Heavy Ions in Matter: SHIM (June 2-5, 2008, Lyon, France), 2008, p. 29-Conference paper (Refereed)
  • 19.
    Yousef, Hanna
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. Materialvetenskap.
    Lindeberg, Mikael
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. Materialvetenskap.
    Martin, H
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. Materialvetenskap.
    A low-cost IR sensor in flexible polyimide foils2006Conference paper (Refereed)
  • 20.
    Yousef, Hanna
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. Materialvetenskap.
    Lindeberg, Mikael
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. Materialvetenskap.
    Martin, H
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. Materialvetenskap.
    Vertical thermopile IR sensor in a flexible foil2006In: Proc. Eurosensors 2006 (Gothenburg, Sweden Sept. 17-22, 2006), 2006, p. 46-47Conference paper (Refereed)
  • 21.
    Yousef, Hanna
    et al.
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. Materialvetenskap.
    Lindeberg, Mikael
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. Materialvetenskap.
    Martin, Hans
    Hjort, Klas
    Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science.
    Verical Thermopile IR Sensor in a Flexible Polyimide Foil2006Conference paper (Refereed)
  • 22.
    Yousef, Hanna
    et al.
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Mikael, Lindeberg
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    Hjort, Klas
    Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science.
    High aspect ratio micron-sized vias in "flex" and polymer foils; using ion irradiation2005In: First International Conference on Multi-Material Micro Manufacture (4M), 2005Conference paper (Other (popular scientific, debate etc.))
1 - 22 of 22
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