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  • 51. Rosengren, L
    et al.
    Bäcklund, Ylva
    Sjöström, T
    Hök, Bertil
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Svedbergh, Björn
    A system for wireless intraocular pressure measurements using a silicon micromachined sensor1992Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 2, s. 202-204Artikkel i tidsskrift (Fagfellevurdert)
  • 52.
    Sharma, Guniana
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Klintberg, Lena
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Hjort, Klas
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Viton-based fluoroelastomer microfluidics2011Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 21, nr 2, s. 025016-025023Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    Viton is an elastomer with low permeability and high chemical resistance. This paper presents the main characteristics and technical issues involved in fabricating Viton-based microfluidics by micromoulding, bonding and metallization. A PDMS (polydimethylsiloxane) mould is used to imprint the Viton compound in a curing step that is followed by a post-curing without the mould. Viton was fusion bonded, with high quality, to itself and to stainless steel when clamped together during a post-curing step. Having low permeability to hydrocarbon liquids, Viton is a well-suited elastomer for making paraffin membrane microactuators, as demonstrated here. These kinds of microactuators may find their applications in fluid handling with hydraulic oils, in vacuum systems or in reactors and analytical systems, where Viton comes in direct contact with fluids that would permeate or degrade other elastomers.

  • 53.
    Sharma, Guniana
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Svensson, S
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Ogden, Sam
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Klintberg, Lena
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Hjort, Klas
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    High-pressure stainless steel active membrane microvalves2011Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 21, nr 7, s. 075010-Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    In this work, high-pressure membrane microvalves have been designed, manufactured andevaluated. The valves were able to withstand back-pressures of 200 bar with a response timeof less than 0.6 s. These stainless steel valves, manufactured with back-end batch production,utilize the large volume expansion coupled to the solid–liquid phase transition in paraffin wax.When membrane materials were evaluated, parylene coated stainless steel was found to be thebest choice as compared to polydimethylsiloxane and polyimide. Also, the influence of theorifice placement and diameter is included in this work. If the orifice is placed too close to therim of the membrane, the valve can stay sealed even after turning the power off, and the valvewill not open until the pressure in the system is released. The developed steel valves, evaluatedfor both water and air, provide excellent properties in terms of mechanical stability, ease offabrication, and low cost. Possible applications include sampling at high pressures, chemicalmicroreactors, high performance liquid chromatography, pneumatics, and hydraulics.

  • 54.
    Strandman, Carola
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap. Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Elektronik.
    Backlund, Ylva
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap. Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Elektronik.
    Passive and fixed alignment of devices using flexible silicon elements formed by selective etching1998Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 8, nr 1, s. 39-44Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    Assembly systems consisting of aligning pits combined with flexible holding elements have been produced for both passive and fixed alignment of devices such as chips and optical fibres. The free-standing holding elements were fabricated in bulk silicon us

  • 55.
    Sturesson, Peter
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Khaji, Zahra
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Knaust, Stefan
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Klintberg, Lena
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Thornell, Greger
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Thermomechanical properties and performance of ceramic resonators for wireless pressure reading in high temperatures2015Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 25, nr 9, artikkel-id 095016Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    This paper reports on the design, fabrication and thermomechanical study of ceramic LC resonators for wireless pressure reading, verified at room temperature, at 500 °C and at 1000 °C for pressures up to 2.5 bar. Five different devices were fabricated of high-temperature co-fired ceramics (HTCC) and characterized. Alumina green tape sheets were screen printed with platinum paste, micromachined, laminated and fired. The resulting samples were 21 x 19 mm2 with different thicknesses. An embedded communicator part was integrated with either a passive backing part or with a pressure-sensing element, including an 80 μm thick and 6 mm diameter diaphragm. The study includes measuring thermally and mechanically induced resonance frequency shifts, and thermally induced deformations. For the pressure sensor device, contributions from changes in the relative permittivity and from expanding air, trapped in the cavity, were extracted. The devices exhibited thermomechanical robustness during heating, regardless of the thickness of the backing. The pressure sensitivity decreased with increasing temperature from 15 050 ppm/bar at room temperature to 2400 ppm/bar at 1000°C, due to the decreasing pressure difference between the external pressure and the air pressure inside the cavity. 

  • 56.
    Surpi, Alessandro
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Fysiska sektionen, Institutionen för fysik och materialvetenskap.
    Valizadeh, Sima
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Tillämpad materialvetenskap.
    Leifer, Klaus
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Tillämpad materialvetenskap.
    Lagomarsino, Stefano
    Istituto di Fotonica e Nanotecnologie (CNR) Via Cineto Romano 42, 00156 Roma, Italy.
    Focused ion beam fabrication procedures of x-ray micro Fresnel zone plates2007Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 17, nr 3, s. 617-622Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    In this paper the use of focused ion beam (FIB) mask-less lithography is presented as a novel and simple way to fabricate x-ray Fresnel zone plates (FZPs), and a prototype of a FIB-made 100 nm resolution FZP with 38 zones is described. Considerations for future developments—the maximum aspect ratio achievable by FIB lithography in nickel, a way to produce zones with a parabolic transverse profile, as theoretically required for the highest efficiency in focusing—are also reported.

  • 57.
    Söderkvist, J
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    A phenomenological method of predicting the performance of piezoelectric beams1991Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 1, nr 1, s. 16-24Artikkel i tidsskrift (Fagfellevurdert)
  • 58.
    Söderkvist, J
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Hjort, Klas
    The piezoelectric effect of GaAs used for resonators and resonant sensors1994Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 4, s. 28-34Artikkel i tidsskrift (Fagfellevurdert)
  • 59.
    Söderkvist, Jan
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Similarities betwen piezoelectric, thermal and other internal means of exciting vibrations1993Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 3, s. 24-31Artikkel i tidsskrift (Fagfellevurdert)
  • 60.
    Thornell, Greger
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap.
    Klintberg, Lena
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap.
    Laurell, T
    Nilsson, J
    Johansson, Stefan
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap.
    Desktop microfabrication: initial experiments with a piezoceramic1999Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 9, nr 4, s. 434-437Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    A method for building microstructures from a suspension of micrometre-sized piezoelectric particles by depositing droplets on top of droplets and promoting drying is devised. A micromachined dispensing unit similar to a drop-on-demand inkjet-printer head is used. The relation of the vertical building rate to the ejection frequency and the substrate temperature is established, and a mechanism explaining the tubular structures built is proposed.

  • 61.
    Thorslund, Sara
    et al.
    Uppsala universitet, Medicinska och farmaceutiska vetenskapsområdet, Medicinska fakulteten, Institutionen för medicinsk biokemi och mikrobiologi. Uppsala universitet, Science for Life Laboratory, SciLifeLab.
    Nguyen, Hugo
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Läräng, Thomas
    Uppsala universitet, Medicinska och farmaceutiska vetenskapsområdet, Medicinska fakulteten, Institutionen för medicinsk biokemi och mikrobiologi. Uppsala universitet, Science for Life Laboratory, SciLifeLab.
    Barkefors, Irmeli
    Uppsala universitet, Medicinska och farmaceutiska vetenskapsområdet, Medicinska fakulteten, Institutionen för medicinsk biokemi och mikrobiologi. Uppsala universitet, Science for Life Laboratory, SciLifeLab.
    Kreuger, Johan
    Uppsala universitet, Medicinska och farmaceutiska vetenskapsområdet, Medicinska fakulteten, Institutionen för medicinsk biokemi och mikrobiologi. Uppsala universitet, Science for Life Laboratory, SciLifeLab.
    A disposable and multifunctional capsule for easy operation of microfluidic elastomer systems2011Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 21, nr 12, s. 127001-Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    The global lab-on-chip and microfluidic markets for cell-based assays have been predicted to grow considerably, as novel microfluidic systems enable cell biologists to perform in vitro experiments at an unprecedented level of experimental control. Nevertheless, microfluidic assays must, in order to compete with conventional assays, be made available at easily affordable costs, and in addition be made simple to operate for users having no previous experience with microfluidics. We have to this end developed a multifunctional microfluidic capsule that can be mass-produced at low cost in thermoplastic material. The capsule enables straightforward operation of elastomer inserts of optional design, here exemplified with insert designs for molecular gradient formation in microfluidic cell culture systems. The integrated macro–micro interface of the capsule ensures reliable connection of the elastomer fluidic structures to an external perfusion system. A separate compartment in the capsule filled with superabsorbent material is used for internal waste absorption. The capsule assembly process is made easy by integrated snap-fits, and samples within the closed capsule can be analyzed using both inverted and upright microscopes. Taken together, the capsule concept presented here could help accelerate the use of microfluidic-based biological assays in the life science sector.

  • 62.
    Thorslund, Sara
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Nikolajeff, Fredrik
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Tillämpad materialvetenskap.
    Instant oxidation of closed microchannels2007Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 17, nr 4, s. N16-N21Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    A new method for instant oxidation of closed, bonded microchannels is presented and evaluated. By placing the tip-formed electrode of a corona plasma equipment in the reservoir of a PDMS microstructure, the plasma spark can spread into the microchannel and oxidize the inner PDMS channel walls. By applying this process, the non-specific adsorption of hydrophobic affinity analytes is markedly decreased, here evaluated with the fluorescent dye Rhodamine B and standard protein BSA. The results show that the surface adsorption in plasma-treated channels is reduced significantly, e.g. the amount of BSA adsorbed at 35 mm distance from the reservoir is only 35% of the amount of BSA adsorbed in non-treated channels. The surface shows very low adsorption during the first 200 min after oxidation, and has recovered (90%) its hydrophobicity first after 24 h. This method of instant surface oxidation has in our group been widely used to simplify microfluidic studies of microstructure prototypes, since the need of other more complicated surface modifications to lower analyte adsorption is eliminated.

  • 63.
    Vangbo, Mattias
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap. Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Elektronik.
    Backlund, Ylva
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap. Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Elektronik.
    A lateral symmetrically bistable buckled beam1998Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 8, nr 1, s. 29-32Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    We have micromachined a lateral symmetrically bistable buckled beam for snap-in holding structures by oxidizing released beams micromachined on thick silicon-on-insulator wafers. The wafers were prepared by bonding and chemical mechanical polishing, and t

  • 64.
    Vangbo, Mattias
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap. Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Elektronik.
    Bäcklund, Ylva
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap. Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Elektronik.
    Terracing of (100) Si with one mask and one etching step using misaligned V-grooves1996Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 6, nr 1, s. 39-42Artikkel i tidsskrift (Fagfellevurdert)
  • 65.
    Vangbo, Mattias
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap. Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Elektronik.
    Karlsson, S
    Backlund, Ylva
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för materialvetenskap. Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Elektronik.
    Low cost micromachined mirrors for display systems1999Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 9, nr 1, s. 85-88Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    A concept for the fabrication of low cost resonant scanning miners using standard microstructure technology is proposed. To demonstrate the process a mirror device for a head mounted display system was designed and fabricated. The mirror was successfully

  • 66.
    Werr, Gabriel
    et al.
    Tech Univ Munich, Inst Med & Polymer Engn, D-80333 Munich, Germany.
    Khaji, Zahra
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik. Uppsala universitet, Science for Life Laboratory, SciLifeLab.
    Ohlin, Mathias
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik. Uppsala universitet, Science for Life Laboratory, SciLifeLab. Aimpoint AB, S-21375 Malmo, Sweden.
    Andersson, Martin
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Klintberg, Lena
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Searle, Sean
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik. Uppsala universitet, Science for Life Laboratory, SciLifeLab. Natl Univ Singapore, Dept Biomed Engn, Singapore 117583, Singapore.
    Hjort, Klas
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Tenje, Maria
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik. Uppsala universitet, Science for Life Laboratory, SciLifeLab.
    Integrated thin film resistive sensors for in situ temperature measurements in an acoustic trap2019Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 29, nr 9, artikkel-id 095003Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    This work presents an acoustic trap with integrated thin film sensors to monitor temperature variations during operation. The acoustic trap is wet-etched in glass with a thermally bonded glass lid and the thin-film sensors are integrated during fabrication. We evaluated the performance of the integrated temperature sensors and measured a temperature sensitivity of +/- 0.01 degrees C and confirmed that the read-out of the thin film sensors was not affected neither by the ionic conductivity of the solution nor the addition of microparticles into the acoustic trap. From the experiments we observed a temperature increase of the acoustic trap during operation as a result of the dissipative heating of the the piezoelectric element used to actuate the trap. We also showed that when external convective cooling was applied to the system, the temperature increase of the acoustic trap was higher than the temperature increase of the piezoelectric element itself. This shows the importance of using integrated temperature sensors in acoustic trapping to monitor the local environmental conditions.

  • 67.
    Wingqvist, Gunilla
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Arapan, Lilia
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Yantchev, Ventsislav
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Katardjiev, Ilia
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Micromachined thermally compensated thin film Lamb wave resonator for frequency control and sensing applications2009Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 19, nr 3, s. 035018-Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    Micromachined thin film plate acoustic wave resonators (FPAR) utilizing the lowest order symmetric Lamb wave (S0) propagating in highly textured 2μm thick Aluminum Nitride (AlN) membranes have been successfully demonstrated [1]. The proposed devices have a SAW-based design and exhibit Q factors of up to 3000 at a frequency around 900MHz as well as design flexibility with respect to the required motional resistance. However, a notable drawback of the proposed devices is non-zero temperature coefficient of frequency (TCF) which lies in the range -20 ppm/K to –25 ppm/K. Thus, despite the promising features demonstrated, further device optimization is required. In this work temperature compensation of thin AlN film Lamb wave resonators is studied and experimentally demonstrated. Temperature compensation while retaining at the same time the device electromechanical coupling is experimentally demonstrated. The zero TCF Lamb wave resonators are fabricated onto composite AlN/SiO2 membranes. Q factors of around 1400 have been measured at a frequency of around 755 MHz. Finally, the impact of technological issues on the device performance is discussed in view of improving the device performance.

  • 68.
    Wu, Zhigang
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Jobs, Magnus
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Rydberg, Anders
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Hjort, Klas
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Hemispherical coil electrically small antenna made by stretchable conductors printing and plastic thermoforming2015Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 25, nr 2, artikkel-id 027004Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    A production scalable technique is presented to make hemispherical coil antennas by using a stretchable printed silver paste conductor and plastic thermoforming. To ease the fabrication process an unbalanced feed-structure was designed for solderless mounting on conductive materials. The manufactured antenna had a resonance frequency of 2.467 GHz with a reflection coefficient of -33.8 dB. The measured and simulated radiation patterns corresponded to that of monopole structure and the measured efficiency was 40%.

  • 69.
    Wu, Zhigang
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Qun Liu, Ai
    Nanyang Technological University, Singapore.
    Hjort, Klas
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Microfluidic continuous particle/cell separation via electroosmotic-flow-tuned hydrodynamic spreading2007Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 17, nr 10, s. 1992-1999Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    Among the microfluidic separation methods, hydrodynamic spreading is a simple and high-throughput continuous separation technique based on the difference in size. However, it is difficult to adjust tiny pressure differences accurately in microfluidic devices. In this study, a combination of electroosmotic flow (EOF) and hydrodynamic flow spreading was employed to tune the size separation of particles. A stream with different kinds of particle suspensions was driven co-fluently with a particle-free carrier stream under both mechanical external and electroosmotic pressure in a microchannel. The EOF-tuned hydrodynamic spreading behaviour was investigated experimentally and modelled through an electric equivalent model and numerical simulation. When the magnitudes of the mechanically and electroosmotically induced pressures were similar, the EOF tuning on the pressure-driven flow became significant. Hence, the hydrodynamic spreading could be easily adjusted by a tuned power supply. The separation was studied in more detail with 1.9 and 9.9 µm fluorescent polystyrene particles. Moreover, separation of E. coli and yeast cells was accomplished. In conclusion, this technique has the advantages of good stability of mechanical-pressure-driven flow and precise tuning of the EOF, and provides a robust method for size-based separation of particles and cells.

  • 70.
    Yantchev, Ventsislav
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Enlund, Johannes
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Katardjiev, Ilia
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Johansson, Linda
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    A micromachined Stoneley acoustic wave system for continuous flow particle manipulation in microfluidic channels2010Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 20, nr 3, s. 035031-1-035031-5Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    Particle manipulation utilizing interface acoustic waves (IAWs) is proposed for the first time. An IAW-based manipulation system has been designed, micromachined and tested. This work addresses the issue of particle manipulation in microfluidic channels with particular emphasis on particles with submicron dimensions. The subject is of significant relevance for a range of bio-technological applications and in particular for lab-on-chip ones. Submicron particle manipulation in continuous flow has been demonstrated.

  • 71.
    Yantchev, Ventsislav
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Katardjiev, Ilia
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Thin film lamb wave resonators in frequency control and sensing applications: a review2013Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 23, nr 4, s. 043001-Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    This work makes an overview of the progress made during the last decade with regard to a novel class of piezoelectric microwave devices employing acoustic Lamb waves in micromachined thin film membranes. This class of devices is referred to as either thin film Lamb wave resonators or piezoelectric contour-mode resonators both employing thin film aluminum nitride membranes. These devices are of interest for applications in both frequency control and sensing. High quality factor Lamb wave resonators exhibiting low noise, low loss and thermally stable performance are demonstrated and their application in high resolution gravimetric and pressure sensors further discussed. A specific emphasis is put on the ability of these devices to operate in contact with liquids. Future research directions are further outlined.

  • 72.
    Yousef, Hanna
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrostrukturteknik.
    Hjort, Klas
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrostrukturteknik.
    Lindeberg, Mikael
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrostrukturteknik.
    Plated Through-Hole Vias in a Porous Polyimide Foil for Flexible Printed Circuit Boards2008Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 18, nr 1, s. 017001-Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    A fabrication process for high aspect ratio plated through-hole vias is presented for flexibleprinted circuit boards. A 75 μm thick porous Kapton foil that allows direct definition of highaspect ratio through-hole vias by dry photoresist film lithography and electrodeposition ispresented. Pretreatment with swift heavy ion irradiation and wet etching define the poredensity and porosity of the foil, similar to ion-track-etched filter membranes. Thin filmmetallization of a seed layer and lithography of a laminated dry photoresist film define the viasizes and positions. Subsequent through-hole electrodeposition produces vias consisting ofmultiple wires, where each open pore defines one wire. The via geometries are characterizedby scanning electron microscopy. The electrical properties of the vias are characterized byresistance measurements. Vias with an aspect ratio over 2 and a side length of 33 μm showhigh yield with low resistance and low variation in resistance.

  • 73.
    Yousef, Hanna
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Hjort, Klas
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper.
    Lindeberg, Mikael
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
    Reliable small via interconnects made of multiple sub-micron wires in flexible PCB boards2007Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 17, nr 4, s. 700-708Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    A fabrication process for small through-hole vias consisting of multiple sub-micron electrodeposited wires has been developed for flexible printed circuit boards (PCB). The resistance of the vias is controlled by adjusting the number of wires per via, as well as the dimensions of the wires. The process steps include modification of the foils by irradiation with energetic ions, wet etching and metallization of the through-hole vias, double-sided surface metallization of the dielectric layer and interconnection lithography. Series of up to 360 interconnected vias of electrodeposited nickel are demonstrated in a flexible PCB foil (75 µm Kapton HN polyimide). The vias have a lateral size of 26 µm. The metal content of the demonstrated vias is 0.12% and 10% of their total volume, corresponding to a metal cross-section of 3.2 µm2 and 270 µm2, respectively. The electrical resistance per interconnected via is 2.6 Ω and 0.07 Ω, respectively. The vias can carry a current density of at least 4 × 106 A cm−2.

  • 74.
    Zhao, Jie
    et al.
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Song, Man
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Wen, Chenyu
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Majee, Subimal
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Yang, Dong
    Northwest Univ, Coll Chem & Mat Sci, Minist Educ, Key Lab Synthet & Nat Funct Mol Chem, Xian 710069, Shaanxi, Peoples R China..
    Wu, Biao
    Northwest Univ, Coll Chem & Mat Sci, Minist Educ, Key Lab Synthet & Nat Funct Mol Chem, Xian 710069, Shaanxi, Peoples R China..
    Zhang, Shi-Li
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Zhang, Zhi-Bin
    Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Fasta tillståndets elektronik.
    Microstructure-tunable highly conductive graphene-metal composites achieved by inkjet printing and low temperature annealing2018Inngår i: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 28, nr 3, artikkel-id 035006Artikkel i tidsskrift (Fagfellevurdert)
    Abstract [en]

    We present a method for fabricating highly conductive graphene-silver composite films with a tunable microstructure achieved by means of an inkjet printing process and low temperature annealing. This is implemented by starting from an aqueous ink formulation using a reactive silver solution mixed with graphene nanoplatelets (GNPs), followed by inkjet printing deposition and annealing at 100 degrees C for silver formation. Due to the hydrophilic surfaces and the aid of a polymer stabilizer in an aqueous solution, the GNPs are uniformly covered with a silver layer. Simply by adjusting the content of GNPs in the inks, highly conductive GNP/Ag composites (> 106 S m(-1)), with their microstructure changed from a large-area porous network to a compact film, is formed. In addition, the printed composite films show superior quality on a variety of unconventional substrates compared to its counterpart without GNPs. The availability of composite films paves the way to the metallization in different printed devices, e.g. interconnects in printed circuits and electrodes in energy storage devices.

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